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LSD-155Lt: Overview

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Scribing

Cleaving

LSD-155Lt Brochure

The Loomis Industries LSD-155 introduced many new technical features, and it set the standard for automation, productivity, and flexibility. Combining these essential items with accuracy and ease of use make the LSD-155 and new LSD-155Lt the products of choice for processing laser diodes and wafers.

The LSD-155 can be configured to function with your existing equipment and process requirement by utilizing common wafer holding media. These include 6" and 7" ring pairs, saw frames, vacuum chuck and the Loomis square frame. A variety of scribe tools, objective lenses and mandrels and cleaving options are available to optimize the process to your specific application.

To find out more about the future of scribe dicing, view the Features & Specifications.

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