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The Loomis Industries LSD-155 introduces many new technical features, but more importantly, it sets the standard for automation, productivity and flexibility. Combining these essential attributes with accuracy and ease-of-use, make it the product of choice for processing your laser diodes and wafers.
The LSD-155 can be configured to function with your existing equipment and process requirement by utilizing common wafer holding media. These include 6" and 7" ring pairs, saw frames, vacuum chuck and the Loomis square frame. A variety of scribe tools, objective lenses and mandrels and cleaving options are available to optimize the process to your specific application.
To find out more about the future of scribe dicing, view the Features & Specifications.